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The Growth Phase
2009 is a watershed year for Silecs. By mid-summer, in spite of the global slowdown, we had already reached record sales for the year. Our new customers are world leaders in CMOS image sensors and semiconductor foundries. And our next-generation products lead on the frontiers of microelectronics packaging and promise to propel our next phase of growth.
The financial crisis has prompted many device industry leaders to re-examine their approach to advanced materials. They want optimized, environmental electronic material solutions that could help averting huge CAPEX to introduce new products. Our innovative siloxane polymer technology offers the answers.
We lower the cost of ownership and enable next-generation processes and products of our customers. In addition to CMOS image sensor and classic SOG (Spin-On-Glass) applications, our revolutionary technologies now allow advanced chip packaging at ultra-low curing temperatures and improve solar cell panel performance. Our expanded presence in Asia and Europe has strengthened our customer support and co-development capabilities. The recent expansion of our state-of-the-art fabrication facility has not only increased our capacity for the growth ahead, but has also solidified our reputation as the industry leader in quality, purity, and reliability.
My greatest thanks go to our customers for their confidence and our employees for their dedication. They have made this growth possible. And the best is yet to come.
Sincerely,
Kok Whee Teo, Silecs CEO
2009 September