See the following articles by IC industry publications featuring Silecs:
Dielectric Materials
Two dielectric materials are used in front-end-of-line (FEOL) and back-end-of-line (BEOL) processes. ST 100 is an inorganic spin-on oxide for applications such as shallow-trench isolation...
Read more at www.micromagazine.com >
Balazs, Entegris, ICOS, Litel, Olympus, Veeco, Silecs announce products
A slew of semiconductor-equipment and materials vendors this week rolled out new products in an effort to get a jump on next week's Semicon West trade show in San Francisco.
Read more at www.eetimes.com >
Ex-Intel VP joins Silecs Board of Directors
Silecs, Inc. has announced the appointment of a former Intel senior executive to its Board of Directors.
Read more at www.fabtech.org >
Silecs expands Asian market base via distribution deal with Nissan Chemical
Silecs, Inc has increased its specialty dielectric materials fro FEOL and BEOL applications to several metric tons per month by adding new production lines...
Read more at ww.fabtech.org >
New molecular engineered interlevel dielectric patent issued to Silecs
Silecs, Inc., a manufacturer of dielectric materials has received a new US patent, US 6,974,970, that covers several chemical compositions...
Read more at www.fabtech.org >
Silecs expands dielectric material production to meet ramp-up demand
With a successful qualification of a jointly developed optical dielectric material between Nissan Chemical Industries and Silecs, Inc. for a Nissan customer in Japan...
Read more at www.fabtech.org >
Silecs develops new FEOL & BEOL dielectrics
Silecs, Inc. has introduced two new products used as advanced dielectrics for semiconductor manufacturing.
Read more at www.fabtech.org >