Microelectronic devices are fabricated in intricate, multi-step processes in which chemical materials are deposited in ultra-thin layers on a substrate-usually a silicon wafer. Pibond materials are supplied in liquid form, and thus, the technique for applying them is with sophisticated spin-coater systems that carefully deposit measured amounts of material onto a substrate. The system then spins the substrate rapidly to spread the material across the surface, hardened into a highly-uniform thin film. This film then becomes a permanent part of the microchip that directly influences its performance, based on the chemical composition of the film.
Our products become part of everyday electronic products through standard semiconductor production processes.