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Applications 
SAP Series | SC Series | SD Series | SG Series | SK Series | ST Series | SX Series
SAP 100
Application
Photosensitive and non-photosensitive hard mask enables through-silicon-via (TSV) formation for 3-D integration and advanced packaging.
Properties
Ultra-high etch selectivity for via etch; thin layer spin-on solution; wide process window suitable for various process schemes; easy strip and clean; compatible with existing technology.
Advantages
Provides hard mask user desired replacement with low material usage high etch selectivity alternative; Enables higher aspect ratio, smaller feature deep via etch for current and future generation technology nodes IC packaging; Low Cost-of-Ownership.
SAP 200
Application
Photosensitive dielectrics for wafer level, redistribution and solder bumping dielectrics applications for advanced packaging
Properties
Low curing temperature (175C - 190 C); High resolution, negative tone and TMAH developable; Excellent adhesion strength; Low shrinkage and low stress resulting in higher yield.
Advantages
Enables thinned wafer usage with low temperature packaging processes; Minimum thermal mismatch; Competitive cost